Facilities
Capability

      KDPCB Manufacture capability

      Item Description
      Layer 1- 24 Layers 
      Material

      FR-4/CEM-1/CEM-3/Aluminum/copper base material/ High-TG FR-4 /Teflon/PTFE/ Rogers/PI/ etc. 

      Board Thickness Finish Thickness: 0.2mm- 5.0mm
      Min Board Size 10*10mm
      Max Board Size 610*560mm
      Board Thickness Tolerance ≤1.0mm +/-0.1mm;≥1.0mm +/-10%
      Copper thickness(inner&outer) 17.5um-210um (0.5oz-6oz) 
      Min Trace Width 3mil(0.076mm)
      Min Spacing 3mil(0.076mm)
      Min Drilling Dia 0.15mm
      PTH copper thickness 0.4-2mil(10-50um)
      V-cut angle 25°,30°,45°,60°
      Impedance control and tolerance Tolerance: ±10%; ±8%(min)
      Twist&Wrap ≤ 0.5%(min)
      Soldermask Color Green, Red, Blue, White, Black, Yellow, etc.
      Surface Finish/Plating

      HASL/ L.F HASL/ Immersion Gold/ Immersion Silver/ Immersion Tin

      / Hard Gold Plating/ OSP/ Gold Finger/ Carbon Ink.

      Certificate UL Certificate,ROHS,ISO9001, ISO/TS16949,ISO14001,SGS
      Inner packing Vacuum packing,bubble
      Outer Packing exporting Standard cartoon Packing with vacuum,ties

     

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